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@ARTICLE{Zhang:916264,
author = {Zhang, Chaohua and Yan, Gan and Wang, Yibo and Wu, Xuelian
and Hu, Lipeng and Liu, Fusheng and Ao, Weiqin and
Cojocaru-Mirédin, Oana and Wuttig, Matthias and Snyder, G.
Jeffrey and Yu, Yuan},
title = {{G}rain {B}oundary {C}omplexions {E}nable a {S}imultaneous
{O}ptimization of {E}lectron and {P}honon {T}ransport
{L}eading to {H}igh-{P}erformance {G}e{T}e {T}hermoelectric
{D}evices},
journal = {Advanced energy materials},
volume = {13},
number = {3},
issn = {1614-6832},
address = {Weinheim},
publisher = {Wiley-VCH},
reportid = {FZJ-2022-06065},
pages = {2203361 -},
year = {2023},
abstract = {Grain boundaries (GBs) form ubiquitous microstructures in
polycrystalline materials which play a significant role in
tuning the thermoelectric figure of merit (ZT). However, it
is still unknown which types of GB features are beneficial
for thermoelectrics due to the challenge of correlating
complex GB microstructures with transport properties. Here,
it is demonstrated that GB complexions formed by Ga
segregation in GeTe-based alloys can optimize electron and
phonon transport simultaneously. The Ga-rich complexions
increase the power factor by reducing the GB resistivity
with slightly improved Seebeck coefficients. Simultaneously,
they lower the lattice thermal conductivity by strengthening
the phonon scattering. In contrast, Ga2Te3 precipitates at
GBs act as barriers to scatter both phonons and electrons
and are thus unable to improve ZT. Tailoring GBs combined
with the beneficial alloying effects of Sb and Pb enables a
peak ZT of ≈2.1 at 773 K and an average ZT of 1.3 within
300–723 K for Ge0.78Ga0.01Pb0.1Sb0.07Te. The corresponding
thermoelectric device fabricated using 18-pair p-n legs
shows a power density of 1.29 W cm−2 at a temperature
difference of 476 K. This work indicates that GB complexions
can be a facile way to optimize electron and phonon
transport, further advancing thermoelectric materials.},
cin = {PGI-10},
ddc = {050},
cid = {I:(DE-Juel1)PGI-10-20170113},
pnm = {5233 - Memristive Materials and Devices (POF4-523)},
pid = {G:(DE-HGF)POF4-5233},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000891033200001},
doi = {10.1002/aenm.202203361},
url = {https://juser.fz-juelich.de/record/916264},
}