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@ARTICLE{Wellmann:1008190,
author = {Wellmann, Peter J. and Steiner, Johannes and Strüber, Sven
and Arzig, Matthias and Salamon, Michael and Uhlmann, Norman
and Nguyen, Binh Duong and Sandfeld, Stefan},
title = {{T}he processing chain of the wide bandgap semiconductor
{S}i{C} – {H}ow small steps enabled a mature technology},
journal = {Diamond and related materials},
volume = {136},
issn = {0925-9635},
address = {Amsterdam [u.a.]},
publisher = {Elsevier Science},
reportid = {FZJ-2023-02236},
pages = {109895 -},
year = {2023},
abstract = {This work paper was presented as a keynote lecture at the
international conference on diamond and related materials in
Lisbon (Portugal) in the year 2022. This paper summarizes in
the first part the processing chain of the semiconductor
material SiC from the raw material to epitaxially-ready
wafers as they are used for electronic device manufacturing.
In the second part a current research study, the reduction
of the basal plane dislocation density in SiC crystal growth
is presented. Among other defects, basal plane dislocations
belong to the more severe structural defects in SiC with
respect to degradation during electronic device operation.
In the third part the applicability of X-ray topography to
reveal dislocations and other structural defects in SiC is
outlined in a review style.},
cin = {IAS-9},
ddc = {670},
cid = {I:(DE-Juel1)IAS-9-20201008},
pnm = {5111 - Domain-Specific Simulation $\&$ Data Life Cycle Labs
(SDLs) and Research Groups (POF4-511)},
pid = {G:(DE-HGF)POF4-5111},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000976520900001},
doi = {10.1016/j.diamond.2023.109895},
url = {https://juser.fz-juelich.de/record/1008190},
}