Contribution to a conference proceedings FZJ-2024-00364

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On the Plausibility of Thermodiffusion as the Primary Mechanism for Unipolar Resistive Switching in Metal-Oxide-Metal Memristive Devices

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2023
IEEE

2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), KobeKobe, Japan, 27 Sep 2023 - 29 Sep 20232023-09-272023-09-29 IEEE 1 pp. () [10.23919/SISPAD57422.2023.10319615]

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Contributing Institute(s):
  1. Elektronische Materialien (PGI-7)
  2. JARA-FIT (JARA-FIT)
Research Program(s):
  1. 5233 - Memristive Materials and Devices (POF4-523) (POF4-523)
  2. BMBF 16ME0399 - Verbundprojekt: Neuro-inspirierte Technologien der künstlichen Intelligenz für die Elektronik der Zukunft - NEUROTEC II - (BMBF-16ME0399) (BMBF-16ME0399)
  3. BMBF 16ME0398K - Verbundprojekt: Neuro-inspirierte Technologien der künstlichen Intelligenz für die Elektronik der Zukunft - NEUROTEC II - (BMBF-16ME0398K) (BMBF-16ME0398K)

Appears in the scientific report 2023
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 Record created 2024-01-10, last modified 2024-03-11



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