001     138285
005     20210131025948.0
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|a 10.1109/TED.2013.2277559
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|a 0018-9383
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037 _ _ |a FZJ-2013-04442
082 _ _ |a 620
100 1 _ |0 P:(DE-HGF)0
|a Yang, Shu
|b 0
|e Corresponding author
245 _ _ |a Fabrication and Characterization of Enhancement-Mode High-kappa LaLuO3-AlGaN/GaN MIS-HEMTs
260 _ _ |a New York, NY
|b IEEE
|c 2013
336 7 _ |a Journal Article
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336 7 _ |a article
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500 _ _ |3 POF3_Assignment on 2016-02-29
520 _ _ |a In this paper, we investigate the enhancement-mode (E-mode) ${rm LaLuO}_{3}$ (LLO)-AlGaN/GaN metal-insulator-semiconductor high-electron mobility transistors (MIS-HEMTs) fabricated using fluorine (F) plasma ion implantation with a gate-dielectric-first planar process. The E-mode MIS-HEMTs exhibit a threshold voltage $(V_{rm TH})$ of 0.6 V, a peak transconductance of ${sim}{rm 193}~{rm mS}/{rm mm}$, a small hysteresis of 0.04 V in linear region characterized by a pulse-mode current-voltage measurement, and significantly suppressed current collapse under high-drain-bias switching conditions. X-ray photoelectron spectroscopy and secondary ion mass spectrometry analyses manifest that the negatively charged F ions penetrating into the (Al)GaN barrier layer serve as the primary $V_{rm TH}$ modulation mechanism, whereas the F ions in the fluorinated LLO film form chemical bonds with La/Lu atoms and become charge-neutral. The suppressed current collapse is verified as an advantageous byproduct of the F plasma ion implantation that also fluorinated the SiNx sidewalls in the vicinity of the gate electrode, and therefore, suppress electron injection to the gate-drain access region.
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|a Huang, Sen
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700 1 _ |0 P:(DE-HGF)0
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|a 10.1109/TED.2013.2277559
|g Vol. 60, no. 10, p. 3040 - 3046
|n 10
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