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@ARTICLE{Villa:171759,
      author       = {Villa, Federica and Lussana, Rudi and Bronzi, Danilo and
                      Tisa, Simone and Tosi, Alberto and Zappa, Franco and Dalla
                      Mora, Alberto and Contini, Davide and Durini, Daniel and
                      Weyers, Sasha and Brockherde, Werner},
      title        = {{CMOS} {I}mager {W}ith 1024 {SPAD}s and {TDC}s for
                      {S}ingle-{P}hoton {T}iming and 3-{D} {T}ime-of-{F}light},
      journal      = {IEEE journal of selected topics in quantum electronics},
      volume       = {20},
      number       = {6},
      issn         = {1558-4542},
      address      = {New York, NY},
      publisher    = {IEEE},
      reportid     = {FZJ-2014-05325},
      pages        = {1 - 10},
      year         = {2014},
      abstract     = {We present a CMOS imager consisting of 32 × 32 smart
                      pixels, each one able to detect single photons in the 300
                      – 900 nm wavelength range and to perform both
                      photon-counting and photon-timing operations on very fast
                      optical events with faint intensities. In photon-counting
                      mode, the imager provides photonnumber (i.e., intensity)
                      resolvedmovies of the scene under observation, up to 100 000
                      frames/s. In photon-timing, the imager provides photon
                      arrival times with 312 ps resolution. The result are videos
                      with either time-resolved (e.g., fluorescence) maps of a
                      sample, or 3-D depth-resolvedmaps of a target scene. The
                      imager is fabricated in a cost-effective
                      0.35-μmCMOStechnology, automotive certified. Each pixel
                      consists of a single-photon avalanche diode with 30 μm
                      photoactive diameter, coupled to an in-pixel 10-bit
                      time-to-digital converter with 320-ns full-scale range, an
                      INL of $10\%$ LSB and a DNL of $2\%$ LSB. The chip operates
                      in global shutter mode, with full frame times down to 10 μs
                      and just 1-ns conversion time. The reconfigurable imager
                      design enables a broad set of applications, like
                      time-resolved spectroscopy, fluorescence lifetime imaging,
                      diffusive optical tomography, molecular imaging,
                      time-of-flight 3-D ranging and atmospheric layer sensing
                      through LIDAR.},
      cin          = {ZEA-2},
      ddc          = {530},
      cid          = {I:(DE-Juel1)ZEA-2-20090406},
      pnm          = {434 - Optics and Photonics (POF2-434) / 433 - Process
                      Development (POF2-433) / 541 - Photons (POF2-541) / 631 -
                      Terrestrial Vehicles (POF2-631)},
      pid          = {G:(DE-HGF)POF2-434 / G:(DE-HGF)POF2-433 /
                      G:(DE-HGF)POF2-541 / G:(DE-HGF)POF2-631},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000357666800001},
      doi          = {10.1109/JSTQE.2014.2342197},
      url          = {https://juser.fz-juelich.de/record/171759},
}