Home > Publications database > CMOS Imager With 1024 SPADs and TDCs for Single-Photon Timing and 3-D Time-of-Flight |
Journal Article | FZJ-2014-05325 |
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2014
IEEE
New York, NY
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Please use a persistent id in citations: doi:10.1109/JSTQE.2014.2342197
Abstract: We present a CMOS imager consisting of 32 × 32 smart pixels, each one able to detect single photons in the 300 – 900 nm wavelength range and to perform both photon-counting and photon-timing operations on very fast optical events with faint intensities. In photon-counting mode, the imager provides photonnumber (i.e., intensity) resolvedmovies of the scene under observation, up to 100 000 frames/s. In photon-timing, the imager provides photon arrival times with 312 ps resolution. The result are videos with either time-resolved (e.g., fluorescence) maps of a sample, or 3-D depth-resolvedmaps of a target scene. The imager is fabricated in a cost-effective 0.35-μmCMOStechnology, automotive certified. Each pixel consists of a single-photon avalanche diode with 30 μm photoactive diameter, coupled to an in-pixel 10-bit time-to-digital converter with 320-ns full-scale range, an INL of 10% LSB and a DNL of 2% LSB. The chip operates in global shutter mode, with full frame times down to 10 μs and just 1-ns conversion time. The reconfigurable imager design enables a broad set of applications, like time-resolved spectroscopy, fluorescence lifetime imaging, diffusive optical tomography, molecular imaging, time-of-flight 3-D ranging and atmospheric layer sensing through LIDAR.
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