001     25967
005     20180210134146.0
024 7 _ |2 DOI
|a 10.1016/S0955-2219(01)00439-3
024 7 _ |2 WOS
|a WOS:000175329300013
037 _ _ |a PreJuSER-25967
041 _ _ |a eng
082 _ _ |a 660
084 _ _ |2 WoS
|a Materials Science, Ceramics
100 1 _ |a Prume, K.
|b 0
|0 P:(DE-HGF)0
245 _ _ |a Modelling and numerical simulation of the electrical, mechanical and thermal coupled behaviour of MLCs
260 _ _ |a Amsterdam [u.a.]
|b Elsevier Science
|c 2002
300 _ _ |a 1285 - 1296
336 7 _ |a Journal Article
|0 PUB:(DE-HGF)16
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336 7 _ |a Journal Article
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336 7 _ |a ARTICLE
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336 7 _ |a JOURNAL_ARTICLE
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336 7 _ |a article
|2 DRIVER
440 _ 0 |a Journal of the European Ceramic Society
|x 0955-2219
|0 3891
|v 22
500 _ _ |a Record converted from VDB: 12.11.2012
520 _ _ |a The modelling of non-linear coupled material characteristics has been used for finite element simulations of the integral device behaviour and mechanical and electrical stress distributions of ceramic multilayer capacitors. A two-dimensional finite element model of standard X7R-type capacitors of different sizes soldered on a printed circuit board has been developed to calculate residual, joining as well as mechanical and electrical load stresses. This model includes the experimentally measured non-linear bias field dependencies of the electric and piezoelectric characteristics of the BaTiO3 based dielectric material. The validation of the model is demonstrated by calculations of the failure probability of soldered capacitors in a four-point bending test under simultaneous electrical loading. The results allow a description and possible improvement of the short-time reliability under particular load cases. (C) 2002 Elsevier Science Ltd. All rights reserved.
536 _ _ |a Materialien, Prozesse und Bauelemente für die Mikro- und Nanoelektronik
|c I01
|2 G:(DE-HGF)
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|x 0
588 _ _ |a Dataset connected to Web of Science
650 _ 7 |a J
|2 WoSType
653 2 0 |2 Author
|a BaTiO3
653 2 0 |2 Author
|a capacitors
653 2 0 |2 Author
|a electrical properties
653 2 0 |2 Author
|a failure analysis
653 2 0 |2 Author
|a simulation
653 2 0 |2 Author
|a strength
700 1 _ |a Franken, K.
|b 1
|0 P:(DE-HGF)0
700 1 _ |a Böttger, U.
|b 2
|0 P:(DE-HGF)0
700 1 _ |a Waser, R.
|b 3
|u FZJ
|0 P:(DE-Juel1)131022
700 1 _ |a Maier, H.
|b 4
|0 P:(DE-HGF)0
773 _ _ |a 10.1016/S0955-2219(01)00439-3
|g Vol. 22, p. 1285 - 1296
|p 1285 - 1296
|q 22<1285 - 1296
|0 PERI:(DE-600)2013983-4
|t Journal of the European Ceramic Society
|v 22
|y 2002
|x 0955-2219
909 C O |o oai:juser.fz-juelich.de:25967
|p VDB
913 1 _ |k I01
|v Materialien, Prozesse und Bauelemente für die Mikro- und Nanoelektronik
|l Informationstechnologie mit nanoelektronischen Systemen
|b Information
|0 G:(DE-Juel1)FUEK252
|x 0
914 1 _ |y 2002
915 _ _ |0 StatID:(DE-HGF)0010
|a JCR/ISI refereed
920 1 _ |k IFF-EKM
|l Elektrokeramische Materialien
|d 31.12.2003
|g IFF
|0 I:(DE-Juel1)VDB35
|x 0
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980 _ _ |a UNRESTRICTED
981 _ _ |a I:(DE-Juel1)PGI-7-20110106


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