guest ::
| Home > Publications database > Modelling and numerical simulation of the electrical, mechanical and thermal coupled behaviour of MLCs |
| Home > Publications database > Modelling and numerical simulation of the electrical, mechanical and thermal coupled behaviour of MLCs |
| Journal Article | PreJuSER-25967 |
; ; ; ;
2002
Elsevier Science
Amsterdam [u.a.]
This record in other databases: 
Please use a persistent id in citations: doi:10.1016/S0955-2219(01)00439-3
Abstract: The modelling of non-linear coupled material characteristics has been used for finite element simulations of the integral device behaviour and mechanical and electrical stress distributions of ceramic multilayer capacitors. A two-dimensional finite element model of standard X7R-type capacitors of different sizes soldered on a printed circuit board has been developed to calculate residual, joining as well as mechanical and electrical load stresses. This model includes the experimentally measured non-linear bias field dependencies of the electric and piezoelectric characteristics of the BaTiO3 based dielectric material. The validation of the model is demonstrated by calculations of the failure probability of soldered capacitors in a four-point bending test under simultaneous electrical loading. The results allow a description and possible improvement of the short-time reliability under particular load cases. (C) 2002 Elsevier Science Ltd. All rights reserved.
Keyword(s): J ; BaTiO3 (auto) ; capacitors (auto) ; electrical properties (auto) ; failure analysis (auto) ; simulation (auto) ; strength (auto)
|
The record appears in these collections: |