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@ARTICLE{Zhong:280724,
author = {Zhong, Lianbing and Liu, Limeng and Worsch, Christian and
Gonzalez, Jesus and Springer, André and Ye, Feng},
title = {{T}ransient liquid phase sintering of tantalum carbide
ceramics by using silicon as the sintering aid and its
effects on microstructure and mechanical properties},
journal = {Materials chemistry and physics},
volume = {149-150},
issn = {0254-0584},
address = {New York, NY [u.a.]},
publisher = {Elsevier},
reportid = {FZJ-2016-00481},
pages = {505 - 511},
year = {2015},
abstract = {Tantalum carbide composites with 0.76–8.85 $wt.\%$
elemental silicon as a sintering aid were fabricated by
spark plasma sintering (SPS) at 1700 °C and 30 MPa for 5
min. The transient-liquid-phase sintering behavior, the
microstructures and the mechanical properties of the
tantalum carbide composites were investigated. Oxide
impurities present on the surfaces of the tantalum carbide
particles were eliminated by reactions with the elemental
silicon in a temperature range from 1271 °C to 1503 °C to
benefit densification. Then the silicon melted at its
melting point temperature of 1413 °C to facilitate
rearrangement of the tantalum carbide particles. By the end
of the densification, the elemental silicon transformed into
more refractory TaSi2 and SiC in the consolidated ceramics
by reactions with the tantalum carbide at temperatures lower
than 1773 °C. Both TaSi2 and SiC particles improved
densification by physically pinning growth of the tantalum
carbide grains. Further densification was resulted from
creep flow of the silicides after brittle-to-ductile
transformation of the silicides at temperatures <1650 °C.
Due to the good effects of using elemental silicon as the
sintering aid, all the compositions reached densities
$>96.7\%$ theoretical. The average grain sizes in the
consolidated materials decreased with the silicon addition
from about 19 μm in the 0.76 $wt.\%$ Si composition to
about 9 μm in the 8.85 $wt.\%$ Si composition. A good
flexural strength up to ∼709 MPa was reached in the 8.85
$wt.\%$ Si material due to full density and fine
microstructure.},
cin = {IEK-1},
ddc = {540},
cid = {I:(DE-Juel1)IEK-1-20101013},
pnm = {899 - ohne Topic (POF3-899)},
pid = {G:(DE-HGF)POF3-899},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000347576900070},
doi = {10.1016/j.matchemphys.2014.10.052},
url = {https://juser.fz-juelich.de/record/280724},
}