%0 Journal Article
%A Kronholz, S.
%A Karthäuser, S.
%A van der Hart, A.
%A Wandlowski, Th.
%A Waser, R.
%T Metallic Nanogaps with Access Windows for Liquid-based Systems
%J Microelectronics Journal
%V 37
%@ 0026-2692
%C Amsterdam [u.a.]
%I Elsevier Science
%M PreJuSER-51241
%P 591 - 594
%D 2006
%Z Record converted from VDB: 12.11.2012
%X A new method has been established for the reproducible fabrication of high quality, metallic nanogaps on silicon chips suitable for liquid based nanometer scale devices. Realization of mu m structures connected to nanogaps with gap sizes down to 30 nm has been achieved by a combination of an optical and an electron-beam (e-beam) lithography step using an optimised adhesion layer/metallic layer combination (Ti/Pt/Au-three layer combination) and an adopted two layer e-beam resist. The quality of the interconnects between optically and e-beam lithographically defined structures and the surface roughness of the gold nanogaps have been improved by a controlled temperature treatment. With this method the production of a variety of different gap shapes could be demonstrated. Specifically the lithographic structures have been successfully covered by a protection layer, except of a 200 nm x 400 nm size access window located on top of the nanogaps, making it suitable for applications in liquid environment such as molecular and/or electrochemical metal deposition. (C) 2005 Elsevier Ltd. All rights reserved.
%K J (WoSType)
%F PUB:(DE-HGF)16
%9 Journal Article
%U <Go to ISI:>//WOS:000238073600007
%R 10.1016/j.mejo.2005.09.031
%U https://juser.fz-juelich.de/record/51241