TY  - JOUR
AU  - Kronholz, S.
AU  - Karthäuser, S.
AU  - van der Hart, A.
AU  - Wandlowski, Th.
AU  - Waser, R.
TI  - Metallic Nanogaps with Access Windows for Liquid-based Systems
JO  - Microelectronics Journal
VL  - 37
SN  - 0026-2692
CY  - Amsterdam [u.a.]
PB  - Elsevier Science
M1  - PreJuSER-51241
SP  - 591 - 594
PY  - 2006
N1  - Record converted from VDB: 12.11.2012
AB  - A new method has been established for the reproducible fabrication of high quality, metallic nanogaps on silicon chips suitable for liquid based nanometer scale devices. Realization of mu m structures connected to nanogaps with gap sizes down to 30 nm has been achieved by a combination of an optical and an electron-beam (e-beam) lithography step using an optimised adhesion layer/metallic layer combination (Ti/Pt/Au-three layer combination) and an adopted two layer e-beam resist. The quality of the interconnects between optically and e-beam lithographically defined structures and the surface roughness of the gold nanogaps have been improved by a controlled temperature treatment. With this method the production of a variety of different gap shapes could be demonstrated. Specifically the lithographic structures have been successfully covered by a protection layer, except of a 200 nm x 400 nm size access window located on top of the nanogaps, making it suitable for applications in liquid environment such as molecular and/or electrochemical metal deposition. (C) 2005 Elsevier Ltd. All rights reserved.
KW  - J (WoSType)
LB  - PUB:(DE-HGF)16
UR  - <Go to ISI:>//WOS:000238073600007
DO  - DOI:10.1016/j.mejo.2005.09.031
UR  - https://juser.fz-juelich.de/record/51241
ER  -