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|a 10.1016/j.mejo.2005.09.031
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037 _ _ |a PreJuSER-51241
041 _ _ |a eng
082 _ _ |a 620
084 _ _ |2 WoS
|a Engineering, Electrical & Electronic
084 _ _ |2 WoS
|a Nanoscience & Nanotechnology
100 1 _ |a Kronholz, S.
|b 0
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245 _ _ |a Metallic Nanogaps with Access Windows for Liquid-based Systems
260 _ _ |c 2006
|a Amsterdam [u.a.]
|b Elsevier Science
300 _ _ |a 591 - 594
336 7 _ |a Journal Article
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440 _ 0 |a Microelectronics Journal
|x 0026-2692
|0 4349
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|v 37
500 _ _ |a Record converted from VDB: 12.11.2012
520 _ _ |a A new method has been established for the reproducible fabrication of high quality, metallic nanogaps on silicon chips suitable for liquid based nanometer scale devices. Realization of mu m structures connected to nanogaps with gap sizes down to 30 nm has been achieved by a combination of an optical and an electron-beam (e-beam) lithography step using an optimised adhesion layer/metallic layer combination (Ti/Pt/Au-three layer combination) and an adopted two layer e-beam resist. The quality of the interconnects between optically and e-beam lithographically defined structures and the surface roughness of the gold nanogaps have been improved by a controlled temperature treatment. With this method the production of a variety of different gap shapes could be demonstrated. Specifically the lithographic structures have been successfully covered by a protection layer, except of a 200 nm x 400 nm size access window located on top of the nanogaps, making it suitable for applications in liquid environment such as molecular and/or electrochemical metal deposition. (C) 2005 Elsevier Ltd. All rights reserved.
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|a lithographic
653 2 0 |2 Author
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653 2 0 |2 Author
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653 2 0 |2 Author
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653 2 0 |2 Author
|a access window
653 2 0 |2 Author
|a liquid based system
700 1 _ |a Karthäuser, S.
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700 1 _ |a van der Hart, A.
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700 1 _ |a Wandlowski, Th.
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700 1 _ |a Waser, R.
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773 _ _ |0 PERI:(DE-600)2000567-2
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|t Microelectronics Journal
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|x 0026-2692
|y 2006
856 7 _ |u http://dx.doi.org/10.1016/j.mejo.2005.09.031
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