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@ARTICLE{Spieker:53406,
author = {Spieker, E. and Hollensteiner, S. and Jäger, W. and
Haselier, H. and Schroeder, H.},
title = {{S}elf-assembled nanostructures on {VS}e2 surfaces induced
by {C}u deposition},
journal = {Microscopy and microanalysis},
volume = {11},
issn = {1431-9276},
address = {New York, NY},
publisher = {Cambridge University Press},
reportid = {PreJuSER-53406},
pages = {456 - 471},
year = {2005},
note = {Record converted from VDB: 12.11.2012},
abstract = {Analytical transmission electron microscopy (TEM) and
scanning electron microscopy (SEM) have been applied for the
characterization of evolution, lateral arrangements,
orientations, and the microscopic nature of nanostructures
formed during the early stages of ultrahigh vacuum electron
beam evaporation of Cu onto surfaces of VSe2 layered
crystals. Linear nanostructure of relatively large lateral
dimension (100-500 nm) and networks of smaller
nanostructures (lateral dimension: 15-30 nm; mesh sizes:
500-2000 nm) are subsequently formed on the substrate
surfaces. Both types of nanostructures are not Cu nanowires
but are composed of two strands of crystalline substrate
material elevating above the substrate surface. For the
large nanostructures a symmetric roof structure with an
inclination angle of approximately 30 degrees with respect
to the substrate surface could be deduced from detailed
diffraction contrast experiments. In addition to the
nanostructure networks a thin layer of a Cu-VSe2
intercalation phase of 3R polytype is observed at the
substrate surface. A dense network of interface dislocations
indicates that the phase formation is accompanied by
in-plane strain. We present a model that explains the
formation of large and small nanostructures as consequences
of compressive layer strains that are relaxed by the
formation of rooflike nanostructures, finally evolving into
the observed networks with increasing deposition time. The
dominating contributions to the compressive layer strains
are considered to be an electronic charge transfer from the
Cu adsorbate to the substrate and the formation of a Cu-VSe2
intercalation compound in a thin surface layer.},
keywords = {J (WoSType)},
cin = {CNI / IFF-IEM},
ddc = {570},
cid = {I:(DE-Juel1)VDB381 / I:(DE-Juel1)VDB321},
pnm = {Materialien, Prozesse und Bauelemente für die Mikro- und
Nanoelektronik},
pid = {G:(DE-Juel1)FUEK252},
shelfmark = {Materials Science, Multidisciplinary / Microscopy},
typ = {PUB:(DE-HGF)16},
pubmed = {pmid:17481326},
UT = {WOS:000232378800008},
doi = {10.1017/S1431927605050373},
url = {https://juser.fz-juelich.de/record/53406},
}