001     5451
005     20180208214537.0
024 7 _ |2 DOI
|a 10.1109/TASC.2009.2019049
024 7 _ |2 WOS
|a WOS:000268282000130
037 _ _ |a PreJuSER-5451
041 _ _ |a eng
082 _ _ |a 530
084 _ _ |2 WoS
|a Engineering, Electrical & Electronic
084 _ _ |2 WoS
|a Physics, Applied
100 1 _ |a Weides, M.
|b 0
|u FZJ
|0 P:(DE-Juel1)VDB59925
245 _ _ |a Josephson Junctions with Centred Step and Local Variation of Critical Current Density
260 _ _ |a New York, NY
|b IEEE
|c 2009
300 _ _ |a 689 - 692
336 7 _ |a Journal Article
|0 PUB:(DE-HGF)16
|2 PUB:(DE-HGF)
336 7 _ |a Output Types/Journal article
|2 DataCite
336 7 _ |a Journal Article
|0 0
|2 EndNote
336 7 _ |a ARTICLE
|2 BibTeX
336 7 _ |a JOURNAL_ARTICLE
|2 ORCID
336 7 _ |a article
|2 DRIVER
440 _ 0 |a IEEE Transactions on Applied Superconductivity
|x 1051-8223
|0 2490
|y 3
|v 19
500 _ _ |a Record converted from VDB: 12.11.2012
520 _ _ |a Superconductor-insulator-ferromagnet-superconductor (SIFS) Josephson tunnel junctions based on Nb/Al2O3/NiCu/Nb stacks with a thickness step in the metallic NiCu interlayer were fabricated. The step height of a few 0.1 nm was defined by optical lithography and controlled etching of both Nb and NiCu layers. Experimentally determined junction parameters by current-voltage characteristics and Fraunhofer pattern indicate a uniform NiCu thickness and similar interface transparencies for etched and non-etched parts. The critical current diffraction pattern was calculated and measured for stepped junctions having the same ground phase difference but different critical current densities in both halves. The measured data show a good agreement with simulations.
536 _ _ |a Grundlagen für zukünftige Informationstechnologien
|c P42
|2 G:(DE-HGF)
|0 G:(DE-Juel1)FUEK412
|x 0
588 _ _ |a Dataset connected to Web of Science
650 _ 7 |a J
|2 WoSType
653 2 0 |2 Author
|a Ferromagnetic materials
653 2 0 |2 Author
|a Josephson junctions
653 2 0 |2 Author
|a superconducting device fabrication
653 2 0 |2 Author
|a thin films
773 _ _ |a 10.1109/TASC.2009.2019049
|g Vol. 19, p. 689 - 692
|p 689 - 692
|q 19<689 - 692
|0 PERI:(DE-600)2025387-4
|t IEEE transactions on applied superconductivity
|v 19
|y 2009
|x 1051-8223
856 7 _ |u http://dx.doi.org/10.1109/TASC.2009.2019049
909 C O |o oai:juser.fz-juelich.de:5451
|p VDB
913 1 _ |k P42
|v Grundlagen für zukünftige Informationstechnologien
|l Grundlagen für zukünftige Informationstechnologien (FIT)
|b Schlüsseltechnologien
|0 G:(DE-Juel1)FUEK412
|x 0
914 1 _ |y 2009
915 _ _ |0 StatID:(DE-HGF)0010
|a JCR/ISI refereed
920 1 _ |k IFF-6
|l Elektronische Materialien
|d 31.12.2010
|g IFF
|0 I:(DE-Juel1)VDB786
|x 0
970 _ _ |a VDB:(DE-Juel1)112987
980 _ _ |a VDB
980 _ _ |a ConvertedRecord
980 _ _ |a journal
980 _ _ |a I:(DE-Juel1)PGI-7-20110106
980 _ _ |a UNRESTRICTED
981 _ _ |a I:(DE-Juel1)PGI-7-20110106


LibraryCollectionCLSMajorCLSMinorLanguageAuthor
Marc 21