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@ARTICLE{Kever:58048,
      author       = {Kever, T. and Nauenheim, C. and Böttger, U. and Waser, R.},
      title        = {{P}reparation and characterisation of amorphous {C}u:
                      7,7,8,8-{T}etracyanoquinodimethane thin films with low
                      surface roughness via thermal co-deposition},
      journal      = {Thin solid films},
      volume       = {515},
      issn         = {0040-6090},
      address      = {Amsterdam [u.a.]},
      publisher    = {Elsevier},
      reportid     = {PreJuSER-58048},
      pages        = {1893 - 1896},
      year         = {2006},
      note         = {Record converted from VDB: 12.11.2012},
      abstract     = {We demonstrate a physical vapor deposition process for
                      preparing amorphous Cu:Tetracyanoquinodimethane (Cu:TCNQ)
                      thin films. Samples made by this co-evaporation process
                      exhibit a smooth surface in the scanning electron
                      microscope. Spectroscopic studies confirmed the formation of
                      a charge transfer (CT) complex with a degree of CT of 0.68.
                      Reproducible resistive switching is observed in a
                      glass/NiCr/Al/Cu:TCNQ/Al sandwich structure. OFF/ON ratios
                      of 10 to 10(2) and impedance values between 100 k Omega and
                      10 M Omega have been measured. Switching voltages for the
                      prepared samples with a film thickness of around 100 run are
                      in the range of 4 +/- 2 V and are fairly symmetrical. The
                      devices have a life time of more than 10(4) switching
                      cycles. (c) 2006 Elsevier B.V. All rights reserved.},
      keywords     = {J (WoSType)},
      cin          = {IFF-IEM / CNI / JARA-FIT},
      ddc          = {070},
      cid          = {I:(DE-Juel1)VDB321 / I:(DE-Juel1)VDB381 /
                      $I:(DE-82)080009_20140620$},
      pnm          = {Grundlagen für zukünftige Informationstechnologien},
      pid          = {G:(DE-Juel1)FUEK412},
      shelfmark    = {Materials Science, Multidisciplinary / Materials Science,
                      Coatings $\&$ Films / Physics, Applied / Physics, Condensed
                      Matter},
      typ          = {PUB:(DE-HGF)16},
      UT           = {WOS:000242931900105},
      doi          = {10.1016/j.tsf.2006.07.028},
      url          = {https://juser.fz-juelich.de/record/58048},
}