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000058275 084__ $$2WoS$$aEngineering, Electrical & Electronic
000058275 084__ $$2WoS$$aNanoscience & Nanotechnology
000058275 084__ $$2WoS$$aInstruments & Instrumentation
000058275 084__ $$2WoS$$aMaterials Science, Multidisciplinary
000058275 084__ $$2WoS$$aMechanics
000058275 1001_ $$0P:(DE-HGF)0$$aYang, Z.$$b0
000058275 245__ $$aA new test facility for efficient evaluation of MEMS contact materials
000058275 260__ $$aBristol$$bInst.$$c2007
000058275 300__ $$a1788
000058275 3367_ $$0PUB:(DE-HGF)16$$2PUB:(DE-HGF)$$aJournal Article
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000058275 440_0 $$017721$$aJournal of Micromechanics and Microengineering$$v17$$x0960-1317
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000058275 520__ $$aA novel test facility for the efficient evaluation of microelectromechanical system ( MEMS) switches and the development of alternative contact materials is described. The facility utilizes the upper cantilever from commercial MEMS contact switches, and tests these against alternative bottom contact materials within a modified atomic force microscope ( AFM). The test closely approximates the real switch, but can accommodate a wider range of test conditions and contact materials. The facility allows alternative contact materials to be easily and quickly incorporated, and therefore evaluated by measuring the number of cycles to failure. The evolution of the wear surfaces of the switch contact materials under test can also be easily examined. In order to demonstrate the facility, the evolution of the contact resistance and wear of a commercial RF MEMS cantilever with Au contacts was monitored under accelerated test conditions, comparing the behavior of Au bottom contacts to an alternative Au-Ni alloy contact material. The Au-Ni( 20 at.%) alloy displayed reduced wear rates and improved switch cycle lifetimes compared to pure Au, while retaining acceptable values of contact resistance.
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000058275 7001_ $$0P:(DE-HGF)0$$aLichtenwalner, D.$$b1
000058275 7001_ $$0P:(DE-HGF)0$$aMorris, A.$$b2
000058275 7001_ $$0P:(DE-HGF)0$$aMenzel, S.$$b3
000058275 7001_ $$0P:(DE-Juel1)VDB61380$$aNauenheim, C.$$b4$$uFZJ
000058275 7001_ $$0P:(DE-HGF)0$$aGruverman, A.$$b5
000058275 7001_ $$0P:(DE-HGF)0$$aKrim, J.$$b6
000058275 7001_ $$0P:(DE-HGF)0$$aKingon, A.$$b7
000058275 773__ $$0PERI:(DE-600)1480280-6$$a10.1088/0960-1317/17/9/006$$gVol. 17, p. 1788$$p1788$$q17<1788$$tJournal of micromechanics and microengineering$$v17$$x0960-1317$$y2007
000058275 8567_ $$uhttp://dx.doi.org/10.1088/0960-1317/17/9/006
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000058275 9141_ $$y2007
000058275 915__ $$0StatID:(DE-HGF)0010$$aJCR/ISI refereed
000058275 9201_ $$0I:(DE-Juel1)VDB786$$d31.12.2010$$gIFF$$kIFF-6$$lElektronische Materialien$$x0
000058275 9201_ $$0I:(DE-Juel1)VDB381$$d14.09.2008$$gCNI$$kCNI$$lCenter of Nanoelectronic Systems for Information Technology$$x1$$z381
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