Home > Publications database > Thin Films of ZrO2 for High-k Applications Employing Engineered Alkoxide- and Amide-Based MOCVD Precursors > print |
001 | 59108 | ||
005 | 20180211175108.0 | ||
024 | 7 | _ | |2 DOI |a 10.1002/cvde.200606512 |
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037 | _ | _ | |a PreJuSER-59108 |
041 | _ | _ | |a eng |
082 | _ | _ | |a 540 |
084 | _ | _ | |2 WoS |a Electrochemistry |
084 | _ | _ | |2 WoS |a Materials Science, Coatings & Films |
084 | _ | _ | |2 WoS |a Physics, Condensed Matter |
100 | 1 | _ | |a Thomas, R. |b 0 |u FZJ |0 P:(DE-Juel1)VDB35139 |
245 | _ | _ | |a Thin Films of ZrO2 for High-k Applications Employing Engineered Alkoxide- and Amide-Based MOCVD Precursors |
260 | _ | _ | |a Weinheim |b Wiley-VCH |c 2007 |
300 | _ | _ | |a |
336 | 7 | _ | |a Journal Article |0 PUB:(DE-HGF)16 |2 PUB:(DE-HGF) |
336 | 7 | _ | |a Output Types/Journal article |2 DataCite |
336 | 7 | _ | |a Journal Article |0 0 |2 EndNote |
336 | 7 | _ | |a ARTICLE |2 BibTeX |
336 | 7 | _ | |a JOURNAL_ARTICLE |2 ORCID |
336 | 7 | _ | |a article |2 DRIVER |
440 | _ | 0 | |a Chemical Vapor Deposition |x 0948-1907 |0 15041 |y 2 |v 13 |
500 | _ | _ | |a Record converted from VDB: 12.11.2012 |
520 | _ | _ | |a Ultrathin ZrO2 films were deposited on SiOx/Si in a multiwafer planetary metal-organic (MO)CVD reactor combined with a liquid delivery system. Two different alkoxide-based precursors, [Zr((OPr)-Pr-i)(2)(tbaoac)(2)] and [Zr((OBu)-Bu-i)(2)(tbaoac(2)] are compared with two amide-based precursors, [Zr(NEt2)(2)(dbml)(2)] and [Zr(NEtMe)(2)(guanid)(2)]. Growth rate, surface roughness, density, and crystallization behavior are compared over a wide range of deposition temperatures (400-700 degrees C). In addition, the influence of the solvents, n-butylacetate, toluene, and hexane, is discussed. The best growth results in terms of low temperature deposition rate, surface roughness, film density, and carbon content were obtained for the new [Zr(NEtMe)(2)(guanid)(2)] precursor. The electrical properties were investigated with metal-insulator-semiconductor (MIS) capacitors. The relative dielectric permittivity was in the range 17-24, depending on the precursor. Compared to standard SiO2 capacitors of similar equivalent oxide thickness, low leakage currents were obtained. |
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588 | _ | _ | |a Dataset connected to Web of Science |
650 | _ | 7 | |a J |2 WoSType |
653 | 2 | 0 | |2 Author |a high-k dielectrics |
653 | 2 | 0 | |2 Author |a metal-organic precursors |
653 | 2 | 0 | |2 Author |a MOCVD |
653 | 2 | 0 | |2 Author |a zirconium oxide |
700 | 1 | _ | |a Bhakta, R. |b 1 |0 P:(DE-HGF)0 |
700 | 1 | _ | |a Milanov, A. |b 2 |0 P:(DE-HGF)0 |
700 | 1 | _ | |a Devi, A. |b 3 |0 P:(DE-HGF)0 |
700 | 1 | _ | |a Ehrhart, P. |b 4 |u FZJ |0 P:(DE-Juel1)VDB3072 |
773 | _ | _ | |a 10.1002/cvde.200606512 |g Vol. 13 |q 13 |0 PERI:(DE-600)1477693-5 |t Chemical vapor deposition |v 13 |y 2007 |x 0948-1907 |
856 | 7 | _ | |u http://dx.doi.org/10.1002/cvde.200606512 |
909 | C | O | |o oai:juser.fz-juelich.de:59108 |p VDB |
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