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@INPROCEEDINGS{Kim:826476,
author = {Kim, Wonjoo and Wouters, Dirk J. and Menzel, Stephan and
Rodenbucher, Christian and Rana, Vikas and Waser, R.},
title = {{L}owering forming voltage and forming-free behavior of
{T}a2{O}5 {R}e{RAM} devices},
publisher = {IEEE},
reportid = {FZJ-2017-00701},
pages = {1},
year = {2016},
note = {ISBN 978-1-5090-2969-3},
abstract = {In this paper, we investigate the impact of Ta and Ta2O5
thickness and of thermal treatment for the Ta2O5 layer on
the forming and switching characteristics of Pt/Ta2O5/Ta/Pt
ReRAM devices. The forming voltage (VFORM) decreases with
increasing Ta and decreasing Ta2O5 thickness. However, VFORM
saturates (~ 2 V) for thicker Ta layers. Thinner Ta2O5
switching layer can further reduce the forming voltage to <;
1 V for 3 nm-thick Ta2O5. However, thinner Ta2O5 degrades
the ROFF / RON ratio and retention of the ReRAM device. On
the other hand, thermal treatment of the Ta2O5 results in
decrease of initial resistance and VFORM, and rapid thermal
anneal at 600°C in O2 ambient induces forming-free behavior
for $70\%$ of the characterized devices. These forming-free
devices show highly reliable switching operation up to 106
cycles with ROFF / RON > 10 and retention time of 104 s at
125 °C.},
month = {Sep},
date = {2016-09-12},
organization = {ESSDERC 2016 - 46th European
Solid-State Device Research Conference,
Lausanne (Switzerland), 12 Sep 2016 -
15 Sep 2016},
cin = {PGI-7},
cid = {I:(DE-Juel1)PGI-7-20110106},
pnm = {524 - Controlling Collective States (POF3-524)},
pid = {G:(DE-HGF)POF3-524},
typ = {PUB:(DE-HGF)8},
doi = {10.1109/ESSDERC.2016.7599612},
url = {https://juser.fz-juelich.de/record/826476},
}