%0 Journal Article
%A Wallburg, Florian
%A Kuna, Meinhard
%A Budnitzki, Michael
%A Schoenfelder, Stephan
%T A material removal coefficient for diamond wire sawing of silicon
%J Wear
%V 504-505
%@ 0043-1648
%C Amsterdam [u.a.]
%I Elsevier Science
%M FZJ-2022-04107
%P 204400 -
%D 2022
%X Diamond wire sawing (DWS) of silicon wafers has replaced loose abrasive sawing (LAS) within a very short time, mainly due to the enormous cost pressure in the photovoltaic industry. However, the LAS process is still much better investigated and understood from a mechanics point of view. This lack of micromechanically substantiated process knowledge is a major challenge in optimisation for a reliable process and the associated improvement in the quality of the products. The present work aims to contribute to this field by deriving a material removal coefficient that can be used at the process level in well-established material removal laws such as the Preston or Archard equation. The results show that the removal coefficient calculated on the basis of finite element simulations indicates a significant increase in material removal for common DWS sawing conditions in comparison to LAS, which is in good agreement with experimental findings.
%F PUB:(DE-HGF)16
%9 Journal Article
%U <Go to ISI:>//WOS:000815795300003
%R 10.1016/j.wear.2022.204400
%U https://juser.fz-juelich.de/record/910737