Journal Article

FZJ-2022-04107

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png A material removal coefficient for diamond wire sawing of silicon

Wallburg, F. (Corresponding author) ; Kuna, M. ; Budnitzki, M.FZJ* ; Schoenfelder, S.

2022
Elsevier Science Amsterdam [u.a.]

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Please use a persistent id in citations: http://hdl.handle.net/2128/33533  doi:10.1016/j.wear.2022.204400

Abstract: Diamond wire sawing (DWS) of silicon wafers has replaced loose abrasive sawing (LAS) within a very short time, mainly due to the enormous cost pressure in the photovoltaic industry. However, the LAS process is still much better investigated and understood from a mechanics point of view. This lack of micromechanically substantiated process knowledge is a major challenge in optimisation for a reliable process and the associated improvement in the quality of the products. The present work aims to contribute to this field by deriving a material removal coefficient that can be used at the process level in well-established material removal laws such as the Preston or Archard equation. The results show that the removal coefficient calculated on the basis of finite element simulations indicates a significant increase in material removal for common DWS sawing conditions in comparison to LAS, which is in good agreement with experimental findings.

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Contributing Institute(s):

1. Materials Data Science and Informatics (IAS-9)

Research Program(s):

1. 899 - ohne Topic (POF4-899) (POF4-899)

Appears in the scientific report 2022

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Database coverage:
; ; Clarivate Analytics Master Journal List ; Current Contents - Engineering, Computing and Technology ; Ebsco Academic Search ; Essential Science Indicators ; IF < 5 ; JCR ; SCOPUS ; Science Citation Index Expanded ; Web of Science Core Collection

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