TY  - JOUR
AU  - Wallburg, Florian
AU  - Kuna, Meinhard
AU  - Budnitzki, Michael
AU  - Schoenfelder, Stephan
TI  - A material removal coefficient for diamond wire sawing of silicon
JO  - Wear
VL  - 504-505
SN  - 0043-1648
CY  - Amsterdam [u.a.]
PB  - Elsevier Science
M1  - FZJ-2022-04107
SP  - 204400 -
PY  - 2022
AB  - Diamond wire sawing (DWS) of silicon wafers has replaced loose abrasive sawing (LAS) within a very short time, mainly due to the enormous cost pressure in the photovoltaic industry. However, the LAS process is still much better investigated and understood from a mechanics point of view. This lack of micromechanically substantiated process knowledge is a major challenge in optimisation for a reliable process and the associated improvement in the quality of the products. The present work aims to contribute to this field by deriving a material removal coefficient that can be used at the process level in well-established material removal laws such as the Preston or Archard equation. The results show that the removal coefficient calculated on the basis of finite element simulations indicates a significant increase in material removal for common DWS sawing conditions in comparison to LAS, which is in good agreement with experimental findings.
LB  - PUB:(DE-HGF)16
UR  - <Go to ISI:>//WOS:000815795300003
DO  - DOI:10.1016/j.wear.2022.204400
UR  - https://juser.fz-juelich.de/record/910737
ER  -