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@ARTICLE{Wallburg:910737,
author = {Wallburg, Florian and Kuna, Meinhard and Budnitzki, Michael
and Schoenfelder, Stephan},
title = {{A} material removal coefficient for diamond wire sawing of
silicon},
journal = {Wear},
volume = {504-505},
issn = {0043-1648},
address = {Amsterdam [u.a.]},
publisher = {Elsevier Science},
reportid = {FZJ-2022-04107},
pages = {204400 -},
year = {2022},
abstract = {Diamond wire sawing (DWS) of silicon wafers has replaced
loose abrasive sawing (LAS) within a very short time, mainly
due to the enormous cost pressure in the photovoltaic
industry. However, the LAS process is still much better
investigated and understood from a mechanics point of view.
This lack of micromechanically substantiated process
knowledge is a major challenge in optimisation for a
reliable process and the associated improvement in the
quality of the products. The present work aims to contribute
to this field by deriving a material removal coefficient
that can be used at the process level in well-established
material removal laws such as the Preston or Archard
equation. The results show that the removal coefficient
calculated on the basis of finite element simulations
indicates a significant increase in material removal for
common DWS sawing conditions in comparison to LAS, which is
in good agreement with experimental findings.},
cin = {IAS-9},
ddc = {670},
cid = {I:(DE-Juel1)IAS-9-20201008},
pnm = {899 - ohne Topic (POF4-899)},
pid = {G:(DE-HGF)POF4-899},
typ = {PUB:(DE-HGF)16},
UT = {WOS:000815795300003},
doi = {10.1016/j.wear.2022.204400},
url = {https://juser.fz-juelich.de/record/910737},
}