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| Hauptseite > Publikationsdatenbank > Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems |
| Hauptseite > Publikationsdatenbank > Lateral Electrochemical Metallization Cells for Reconfigurable Interconnect Systems |
| Journal Article | FZJ-2023-02994 |
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2023
IEEE
[New York, NY]
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Please use a persistent id in citations: doi:10.1109/JEDS.2023.3297855 doi:10.34734/FZJ-2023-02994
Abstract: Lateral electrochemical metallization (ECM) cells are fabricated with a combined spacer/damascene process. The process allows the realization of nanoscale geometrical distances between the two electrodes independent of lithography. Such lateral ECM cells are an essential part in a reconfigurable interconnect system that may yield a strongly increased connectivity in artificial neural networks. The lateral cells show memristive properties comparable to vertical cells with switching voltages in the range of −1.5V to 2.5V. The influence of electrode line edge roughness on SET kinetics of such lateral cells is investigated via kinetic Monte Carlo simulations, finding a minor influence on SET time variability.
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