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Metavalent Bonding in Cubic SnSe Alloys Improves Thermoelectric Properties over a Broad Temperature Range
Lin, N. ; Han, S. ; Ghosh, T. ; Schön, C.-F. ; Kim, D. ; Frank, J. ; Hoff, F. ; Schmidt, T. ; Ying, P. ; Zhu, Y. ; Häser, M. ; Shen, M. ; Liu, M. ; Sui, J. ; Cojocaru-Mirédin, O. ; Zhou, C. ; He, R. ; Wuttig, M.FZJ* ; Yu, Y. (Corresponding author)
2024
Wiley-VCH
Weinheim
This record in other databases:
Please use a persistent id in citations: doi:10.1002/adfm.202315652 doi:10.34734/FZJ-2024-02303
Contributing Institute(s):
- JARA Institut Green IT (PGI-10)
- JARA-FIT (JARA-FIT)
Research Program(s):
- 5233 - Memristive Materials and Devices (POF4-523) (POF4-523)
Appears in the scientific report
2024
Database coverage:
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; Clarivate Analytics Master Journal List ; Current Contents - Electronics and Telecommunications Collection ; Current Contents - Engineering, Computing and Technology ; Current Contents - Physical, Chemical and Earth Sciences ; DEAL Wiley ; Ebsco Academic Search ; Essential Science Indicators ; IF >= 15 ; JCR ; SCOPUS ; Science Citation Index Expanded ; Web of Science Core Collection