| Hauptseite > Publikationsdatenbank > Electrophoretic Deposition of Protective Spinel Coatings for Solid Oxide Cell Interconnects – Towards Stack Integration |
| Contribution to a conference proceedings/Journal Article | FZJ-2026-01833 |
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2026
IOP Publishing
Bristol
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Please use a persistent id in citations: doi:10.1149/1945-7111/ae3ebb doi:10.34734/FZJ-2026-01833
Abstract: We evaluated electrophoretic deposition (EPD) of spinel coatings for solid oxide cell (SOC) interconnects with a focus on stack integration. Two compositions, MnCo1.9Fe0.1O4 (MCF) and CuMn1.8Ni0.2O4 (CMN), were deposited from water/ethanol suspensions and subjected to three thermal routes: direct oxidation and two-step treatments with reduction in Ar/H2 at 900 or 1000 °C followed by oxidation. Structural evolution, chromium evaporation, mass gain, and ex situ area-specific resistance (ASR) were assessed. Sealant compatibility with a Ca-Ba-silicate glass and applicability to representative flow-field geometries were investigated. All coatings formed continuous layers; two-step treatments enhanced densification compared to direct oxidation. Prereduction of MCF layers at 1000 °C yielded the lowest Cr evaporation and mass gain, whereas CMN exhibited chromium ingress, phase variations, and coarsened microstructures. ASR values for all types remained around or below 20 mΩ cm2. Glass-joining produced dense composites; limited cation diffusion was observed for MCF, while CMN showed substantial Cu penetration into the glass. EPD produced uniform, defect-free coatings on complex flow-field structures, with only slight thickness variations across the profile. These results support MCF-EPD with a 1000 °C reduction step and in situ oxidation during stack assembly as a process-compatible route for protective interconnect coatings in high-temperature SOCs, while CMN remains of particular interest for intermediate-temperature applications.
Keyword(s): Materials Science (2nd)
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