Hauptseite > Publikationsdatenbank > Towards future III-nitride based THz OEICs in the UV range |
Contribution to a conference proceedings/Contribution to a book | FZJ-2014-02938 |
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2012
IEEE
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Please use a persistent id in citations: doi:10.1109/ASDAM.2012.6418570
Abstract: A group III-nitride based MSM photodetector integrated with a MESFET in an OEIC circuit is presented exhibiting an exceptionally high 3 dB-bandwidth of 410 GHz. Advances towards circuit improvement by the future implementation of a gate recessed AlGaN/GaN HEMT device are reported. μ-PL is used directly on the processed device to optimize processing with respect to processing related strain and damage effects. It is demonstrated that μ-PL allows insight into device and material optimization which are the strategic key to improved future III-nitride based UV-optoelectronic integrated circuits (OEIC) operated up to the THz range. © 2012 IEEE.
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