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Features of temperature dependence of contact resistivity in ohmic contacts on lapped n-Si

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2012
American Institute of Physics Melville, NY

Journal of applied physics 112, 063703 () [10.1063/1.4752715]

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Abstract: The temperature dependence of contact resistivity rho(c) in lapped silicon specimens with donor concentrations of 5 x 10(16), 3 x 10(17), and 8 x 10(17) cm(-3) was studied experimentally. We found that, after decreasing part of the rho(c)(T) curve in the low temperature range, an increasing part is registered with increasing temperature T. It is demonstrated that the formation of contact to a lapped Si wafer results in the generation of high dislocation density in the near-surface region of the semiconductor and also in ohmic contact behavior. In this case, current flows through the metal shunts associated with dislocations. The theory developed is in good agreement with experimental results. (C) 2012 American Institute of Physics. [http://dx.doi.org/10.1063/1.4752715]

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Note: The authors at ISP acknowledge financial support from the National Academy of Sciences of Ukraine (program "Fundamental problems of nanostructured systems, nanomaterials and nanotechnology") and State program of Ukraine "Nanotechnology and nanomaterials."

Contributing Institute(s):
  1. Bioelektronik (ICS-8)
  2. Jülich-Aachen Research Alliance - Fundamentals of Future Information Technology (JARA-FIT)
  3. Bioelektronik (PGI-8)
Research Program(s):
  1. Grundlagen für zukünftige Informationstechnologien (P42)
  2. BioSoft: Makromolekulare Systeme und biologische Informationsverarbeitung (P45)

Appears in the scientific report 2012
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Medline ; OpenAccess by Allianz-OA ; OpenAccess ; Allianz-Lizenz / DFG ; Current Contents - Social and Behavioral Sciences ; JCR ; NationallizenzNationallizenz ; SCOPUS ; Science Citation Index ; Science Citation Index Expanded ; Thomson Reuters Master Journal List ; Web of Science Core Collection
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PGI-8

 Datensatz erzeugt am 2012-11-16, letzte Änderung am 2024-06-19


Published under German "Allianz" Licensing conditions on 2012-09-19. Available in OpenAccess from 2012-09-19:
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