Applicability of a Flat-Bed Birefringence Setup for the Determination of Threading Dislocations of Silicon Carbide Wafers

Steiner, Johannes; Sandfeld, Stefan; Roder, Melissa; Nguyen, Binh Duong; Wellmann, Peter J.; Danilewsky, Andreas N.

doi:10.4028/p-y8n42h

Journal Article

FZJ-2022-02706

Applicability of a Flat-Bed Birefringence Setup for the Determination of Threading Dislocations of Silicon Carbide Wafers

Steiner, J. (Corresponding author) ; Nguyen, B. D.FZJ* ; Roder, M. ; Danilewsky, A. N. ; Sandfeld, S.FZJ* ; Wellmann, P. J.

2022
Trans Tech Publ. Uetikon

Materials science forum 1062, 113 - 118 (2022) [10.4028/p-y8n42h]

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Please use a persistent id in citations: http://hdl.handle.net/2128/33539 doi:10.4028/p-y8n42h

Abstract: Abstract:Screw-type dislocations like micropipes (MP) and threading screw dislocations (TSD) are prohibiting the function or at least diminishing the efficiency of electronic devices based on silicon carbide (SiC). Therefore, it is essential to characterize wafers in an efficient and fast manner. Molten potassium hydroxide (KOH) etching or white-beam X-ray topography (SWXRT) are either destructive or not economically viable for an in-depth characterization of every wafer of one SiC crystal. Birefringence microscopy is being utilized as a fast and non-destructive characterization method. Instead of microscopic setups, commercially available flat-bed scanners equipped with crossed polarizer foils can be used for fast large-area scans. This work investigates the feasibility of such a setup regarding the detection rate of MPs and TSDs. The results of a full-wafer mapping are compared with birefringence microscopy and KOH etching. In the investigated sample clusters of MPs caused by a polytype switch in the beginning of the growth could be identified by both birefringence microscopy and the flat-bed scanner setup, as well as small angle grain boundaries and TED arrays. However, the resolution of the scanner was not sufficient to identify TSDs. Nevertheless the setup proves to be an easy-to-setup and cheap characterization method, able to quickly identify defect clusters in 4H-SiC wafers.

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