Contribution to a conference proceedings

FZJ-2013-03207

http://join2-wiki.gsi.de/foswiki/pub/Main/Artwork/join2_logo100x88.png A Tezzaron-Chartered 3D-IC electronic for SLHC/ATLAS hybrid pixels detectors test results and irradiations performance

Arutinov, D. ; Barbero, M. ; Breugnon, P. ; Chantepie, B. ; Clemens, J. C. ; Fei, R. ; Fougeron, D. ; Garcia-Sciveres, M. ; Godiot, S. ; Hemperek, T. ; Karagounis, M. ; Kruger, H. ; Mekkaoui, A. ; Perrot, L. ; Rozanov, A. ; Wermes, N. ; Pangaud, P. (Corresponding author)

2011
IEEE
ISBN: 978-1-4673-0118-3

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Please use a persistent id in citations: doi:10.1109/NSSMIC.2011.6154082

Abstract: The ATLAS pixel collaboration has started in 2008 a R&D program to use the latest advances in 3-D electronics technology in order to develop a new Front-End (FE) chip for a vertex detector for High Energy Physics (HEP). This program using the commercial Tezzaron-Chartered 0.13μm LP technology should be able to fulfill the requirements imposed by the ten times higher luminosity given by the High Luminosity LHC accelerator. The FE-TC4-P1 is a hybrid pixel read-out chip realized by the first MPW for HEP. This three dimensional chip includes an analog part called FE-TC4-AE and two digital parts called FE-TC4-DS and FE-TC4-DC. At the same time, several prototypes were realized in Chartered 0.13μm LP technology, in order to disentangle from effects induced by 3D architecture. These FE-C4-P1,2,3 prototypes have proved a good radiation hardness up to 400Mrads as well as good performances. This paper presents results from the FE-TC4-P1 chip which has been recently tested and irradiated.

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Contributing Institute(s):

1. Zentralinstitut für Elektronik (ZEA-2)

Research Program(s):

1. 899 - ohne Topic (POF2-899) (POF2-899)

Appears in the scientific report 2013

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