Home > Publications database > Improved LDMOS performance with buried multi-finger gates |
Journal Article | FZJ-2015-05217 |
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2014
Elsevier
[S.l.] @
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Please use a persistent id in citations: doi:10.1016/j.mee.2014.03.005
Abstract: SOI LDMOS with buried multi-finger gates (BFG) is proposed and fabricated. The BFG acts as field plate, modulating the lateral electric field distribution in the drift region (off-state) and enhances the carrier accumulation at the surface of the drift region (on-state). The proposed BFG SOI LDMOS shows a 13.6% increase of breakdown voltage, 24.4% reduction of on-resistance and 14.4% increase of the transconductance compared with the reference SOI LDMOS without BFG.
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