Journal Article FZJ-2015-00695

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Atomic Layer Deposition of Transparent VO $_{x}$ Thin Films for Resistive Switching Applications

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2014
Wiley-VCH Weinheim

Chemical vapor deposition 20(7-8-9), 291 - 297 () [10.1002/cvde.201407122]

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Abstract: Atomic layer deposition (ALD) offers nearly pinhole-free, conformal, and with good thickness control, metal oxide nanometric thin films required for next-generation memory devices. Here we report on the ALD of VOx thin films grown at about 100°C from a vanadium tri-isopropoxide (VTIP) precursor, with water as the co-reactant, followed by their post-growth treatments, for potential applications in resistive switching (RS) devices. As-grown VOx films are amorphous, and transform into polycrystalline layers upon annealing. Capacitor structures fabricated from amorphous VOx films show current-voltage (I-V) characteristics, interesting for RS applications. Depending on the electroforming conditions, bipolar-type memory switching with a resistance ratio ROFF/RON > 103 is obtained, as well as a combination of memory and threshold switching. The latter is attractive for its highly non-linear I-V characteristics, which is attributed to the temperature-induced insulator-to-metal transition (IMT) in vanadium dioxide.

Classification:

Contributing Institute(s):
  1. Elektronische Materialien (PGI-7)
Research Program(s):
  1. 424 - Exploratory materials and phenomena (POF2-424) (POF2-424)

Appears in the scientific report 2014
Database coverage:
Current Contents - Engineering, Computing and Technology ; Current Contents - Physical, Chemical and Earth Sciences ; IF < 5 ; JCR ; NationallizenzNationallizenz ; SCOPUS ; Science Citation Index ; Science Citation Index Expanded ; Thomson Reuters Master Journal List ; Web of Science Core Collection
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 Record created 2015-01-20, last modified 2021-01-29



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