Journal Article FZJ-2020-01582

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Vertical Ge Gate-All-Around Nanowire pMOSFETs With a Diameter Down to 20 nm

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2020
IEEE New York, NY

IEEE electron device letters 41(4), 533 - 536 () [10.1109/LED.2020.2971034]

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Abstract: In this work, we demonstrate vertical Ge gate-all-around (GAA) nanowire pMOSFETs fabricated with a CMOS compatible top-down approach. Vertical Ge nanowires with diameters down to 20 nm and an aspect ratio of ~11 were achieved by optimized Cl 2 -based dry etching and self-limiting digital etching. Employing a GAA architecture, post-oxidation passivation and NiGe contacts, high performance Ge nanowire pMOSFETs exhibit low SS of 66 mV/dec, small DIBL of 35 mV/V and a high $\text {I}_{ \mathrm{\scriptscriptstyle ON}}/\text{I}_{ \mathrm{\scriptscriptstyle OFF}}$ ratio of ${2.1}\times {10}^{{6}}$ . The electrical behavior was also studied with temperature-dependent measurements. The deviation between the experimental SS and the ideal kT/q $\cdot $ ln10 values stems from the density of interface traps $(\text {D}_{\text {it}})$ . Our measurements suggest that lowering the top contact resistance is a key to further performance improvement of vertical Ge GAA nanowire transistors.

Classification:

Contributing Institute(s):
  1. Halbleiter-Nanoelektronik (PGI-9)
  2. Jülich-Aachen Research Alliance - Fundamentals of Future Information Technology (JARA-FIT)
  3. Elektronische Materialien (PGI-7)
Research Program(s):
  1. 521 - Controlling Electron Charge-Based Phenomena (POF3-521) (POF3-521)

Appears in the scientific report 2020
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OpenAccess ; Clarivate Analytics Master Journal List ; Current Contents - Engineering, Computing and Technology ; IF < 5 ; JCR ; SCOPUS ; Science Citation Index ; Science Citation Index Expanded ; Web of Science Core Collection
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Open Access

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