| Hauptseite > Publikationsdatenbank > Multimodal In Situ Electron Microscopy Platform for Correlative Electro-Thermal Characterization and Failure Analysis |
| Contribution to a conference proceedings/Contribution to a book | FZJ-2025-04492 |
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2025
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Please use a persistent id in citations: doi:10.31399/asm.cp.istfa2025p0567
Abstract: We introduce a correlative in situ platform for electro-thermal studies in both TEM and SEM using the same MEMS-based Nano-Chip. Equipped with up to eight electrodes, the chip enables precise electrical biasing and localized heating of as prepared samples under real operating conditions. A dedicated SEM holder ensures seamless, damage-free transfer from TEM, combining atomic-scale imaging with SEM analytics (EDX, EBSD, TKD) and optional AFM integration. Designed for semiconductor materials, the system captures real-time structural evolution during heating and biasing, delivering artifact-free, multimodal insights for semiconductor reliability, device optimization, and advanced materials development.
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