Contribution to a conference proceedings/Contribution to a book FZJ-2014-02938

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Towards future III-nitride based THz OEICs in the UV range

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2012
IEEE

The Ninth International Conference on Advanced Semiconductor Devices and Mircosystems : [Proceedings] - IEEE, 2012. - ISBN 978-1-4673-1198-4978-1-4673-1197-7978-1-4673-1196-0 - doi:10.1109/ASDAM.2012.6418570
2012 International Conference on Advanced Semiconductor Devices & Microsystems (ASDAM), SmoleniceSmolenice, Slovakia, 11 Nov 2012 - 15 Nov 20122012-11-112012-11-15
IEEE 191,194 () [10.1109/ASDAM.2012.6418570]

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Abstract: A group III-nitride based MSM photodetector integrated with a MESFET in an OEIC circuit is presented exhibiting an exceptionally high 3 dB-bandwidth of 410 GHz. Advances towards circuit improvement by the future implementation of a gate recessed AlGaN/GaN HEMT device are reported. μ-PL is used directly on the processed device to optimize processing with respect to processing related strain and damage effects. It is demonstrated that μ-PL allows insight into device and material optimization which are the strategic key to improved future III-nitride based UV-optoelectronic integrated circuits (OEIC) operated up to the THz range. © 2012 IEEE.


Contributing Institute(s):
  1. Halbleiter-Nanoelektronik (PGI-9)
  2. Elektronische Eigenschaften (PGI-6)
  3. JARA-FIT (JARA-FIT)
Research Program(s):
  1. 423 - Sensorics and bioinspired systems (POF2-423) (POF2-423)

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 Record created 2014-04-28, last modified 2021-01-29


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